SFF-SIG News

Press Contact

Paul Rosenfeld
President, SFF-SIG
2784 Homestead Road #269
Santa Clara, CA USA
+1.650.961.2473
info@sff-sig.com

Press Releases

• Feb 2011: SFF-SIG Standardizes Rugged Memory Expansion with XR-DIMM™ Specification
• Apr 2010: On-line Product Search Added
• Mar 2010: CoreExpress® Specification Approved and Released
• Feb 2010: SUMIT™ Specification Updated to Revision 1.5
• Oct 2009: ISM™ and SUMIT-ISM™ Specifications Approved and Released
• Sep 2009: Pico-ITXe™ and Pico-I/O™ Specifications Approved and Released
• Apr 2009: MiniBlade™ Specification Approved and Released
• Apr 2009: COMIT™ Specification Approved and Released
• Apr 2009: SUMIT™ Specification Updated to Revision 1.3
• Oct 2008: First SUMIT™-based Products Debut at ESC Boston
• Oct 2008: MiniBlade™ Specification First to Address Embedded Storage Requirements
• Oct 2008: SFF-SIG Selects Paul Rosenfeld as President
• Apr 2008: Embedded PC Leaders Introduce SUMIT™ Interface Specification
• Mar 2008: SFF-SIG Adopts Pico-ITX™ Form Factor
• Sep 2007: Small Form Factor Trade Group Formed to Address Emerging Technologies

Articles and Whitepapers

COMs Embrace Next-Gen Interfaces by Colin McCracken, Diamond Systems. PC/104 and Small Form Factors Journal, Summer 2010.

SUMIT™ I/O Expansion Guides Next-Generation Intel Processors into Express Lanes by Bob Burckle, WinSystems. Embedded Intel Resource Catalog, Winter 2009.

Stackable Form Factors Shrink and Evolve with Outstanding Legacy Support by Paul Rosenfeld, SFF-SIG. Embedded Intel Resource Catalog, Winter 2009.

Map your way to the SUMIT™ by Bob Burckle, WinSystems and Will Ouyang, Samtec. PC/104 and Small Form Factors Journal, Winter 2009.

Shrinking the Stack - Footprint, that is by Paul Rosenfeld, SFF-SIG. PC/104 and Small Form Factors Journal, Winter 2009.

SUMIT-ISM™ - Uniting Legacy and Advanced I/O in a Stackable Form Factor by Gary Harris, VersaLogic. RTC Magazine, December 2009.

Tiny Atom™ SBC Targets Power-over-Ethernet Apps by Chris Lane, Jaco Electronics, and Kelly Gillilan, ADLINK Technology. RTC Magazine, November 2009.

ISM™ and SUMIT-ISM™ Specs Bring SUMIT™ Expansion to 90x96mm Stackable Modules Industry Insider article in RTC Magazine, November 2009.

Embedded Form Factors Harness Emerging Technologies to Enable Wireless Systems by Jason Krueger, VersaLogic. RTC Magazine, November 2009.

Designing I/O modules for SUMIT™ by Qi Chen PhD, ADLINK Technology. PC/104 and Small Form Factors Journal, Fall 2009.

Pico-ITXe™ and Pico-I/O™ Specifications Now Available to Spark Smaller Stackable Embedded Systems PC/104 and Small Form Factors Journal, Fall 2009.

A COMIT™ Impacts Embedded Systems Design by Bob Burckle, WinSystems. Embedded Intel Resource Catalog, Fall 2009.

Pico-ITXe™ and Pico-I/O™ Specifications for Smaller Stackable Embedded Systems Industry Insider article in RTC Magazine, October 2009.

SUMIT™ Defines the Next Generation of Small, Stackable Embedded Computing Modules

SUMIT™ Modules Upgrade PC/104 Installed Base with SUMIT™ Interface

SUMIT™ Spec Boosts Stackable Module Design

SUMIT™ aims to unify SBC expansion

The Case for Smaller Form Factors in Industrial Systems

Small Form Factors: A new SIG in town

Pico-ITX™ goes "stackable"

Pico-sized platform ushers in new era for I/O

New specs, new members, new logo