What is COMIT™?

COMIT™ is a third-generation COM specification created to address the following shortcomings with first- and second-generation COMs (computer-on-modules):.

  • Marginal signal integrity for PCI Express 2.0 (Gen 2) and USB 3.0 signals that need to go to expansion slots/sockets/connectors on the carrier board
  • Pinout incompatibilities from low-end to high-end processors/chipsets
  • Interoperability problems still persist due to architecture partitioning and firmware
  • Power supply stiffness, rail sequencing and redundant generation of rails on module and carrier
  • I/O available at carrier connectors optimized for chipset convenience, not real-world applications

The SIG is concerned about how other trade groups are proliferating pinout types of their specifications every few years that are not backward compatible. Such actions that prioritize suppliers ahead of OEM customers result in ecosystem fragmentation and cause OEMs to re-design and re-qualify systems.

SFF-SIG is looking for SBC and COM technology leaders who want to join the COMIT™ Working Group to update the specification to resolve the above issues list before PCIe 2.0 and USB 3.0 endpoint devices arrive in the market, since existing standards don't use the right connector technology to adjust for this without starting over completely. For reference, the current specification is available below. If interested, click the Join Us and Contact Us buttons below.

Specifications

COMIT™ 1.1 Specification (556KB PDF)

COMIT™ 1.0 Specification (536KB PDF)

Press Release

Last updated June 12, 2011
© 2008-2011 Small Form Factor Special Interest Group, Inc. All rights reserved.